发明名称 ANTISCHMELZSICHERUNGSSTRUKTUR UND VERFAHREN ZU IHRER HERSTELLUNG
摘要 An anti-fuse structure characterized by a substrate, an oxide layer formed over the substrate having an opening formed therein, an amorphous silicon material disposed within the opening and contacting the substrate, a conductive protective material, such as titanium tungsten, disposed over the amorphous silicon material, and oxide spacers lining the walls of a recess formed within the protective material. The protective material and the spacers provide tighter programming voltage distributions for the anti-fuse structure and help prevent anti-fuse failure.
申请公布号 DE69211697(D1) 申请公布日期 1996.07.25
申请号 DE1992611697 申请日期 1992.07.24
申请人 VLSI TECHNOLOGY, INC., SAN JOSE, CALIF., US 发明人 BOARDMAN, WILLIAM, J., SAN JOSE, CA 95133, US;CHAN, DAVID, P.-KWAN, SAN RAMON, CA 94583, US;CHANG, KUANG-YEH, LOS GATOS, CA 95032, US;GABRIEL, CALVIN, T., CUPERTINO CA 95014, US;JAIN, VIVEK, MILPITAS, CA 95035, US;NARIANI, SUBHASH, R., SAN JOSE, CA 95131, US
分类号 H01L21/82;H01L21/768;H01L23/525;H01L27/10;(IPC1-7):H01L23/525 主分类号 H01L21/82
代理机构 代理人
主权项
地址