SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To obtain a reliable semiconductor device by preventing wiring from being disconnected and step coverage from deteriorating since the wiring reaching a conductive terminal from the pad electrode of a semiconductor chip is formed through a via hole.

SOLUTION: The semiconductor device comprises a support plate 5 adhered to the surface of the semiconductor substrate 1 so that the semiconductor substrate 1 is covered with a pad electrode 3 formed via an insulating layer 2 made of a silicon oxide film, a silicon nitride film or the like, and the via hole 8 formed so that it reaches the surface of the pad electrode 3 from the rear of the semiconductor substrate 1. The opening diameter of a part close to the surface of the pad electrode is larger than that at a part close to the rear of the semiconductor substrate 1.

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