| 摘要 |
<p>The radiation shielded and packaged integrated circuit semiconductor device (400) includes a lid (470) secured to a base (410) to enclose the integrated circuit die (480) within, wherein the lid (470) and the base (410) are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment (700) includes a die attach slug (790) constructed from a high-Z material disposed between the integrated circuit die (780) and a base (710), in combination with a high-Z material lid (770) to substantially block incident radiation.</p> |
