发明名称 |
COPPER-TUNGSTEN ALLOYS AND PROCESS FOR PRODUCING THE SAME |
摘要 |
Copper-tungsten alloys comprising on the weight basis 5-30 % copper, 0.002-0.04 % phosphorus and the balance substantially consisting of tungsten, and preferably containing 0.1-0.5 % of one or more members selected among cobalt, nickel and iron. The alloys are used as electrode materials, contact materials, semiconductor packaging materials, heat sinks, and so forth. |
申请公布号 |
WO9622401(A1) |
申请公布日期 |
1996.07.25 |
申请号 |
WO1996JP00080 |
申请日期 |
1996.01.19 |
申请人 |
TOHO KINZOKU CO., LTD.;AKIYOSHI, NAOYOSHI;NAKADA, KIMIO;KODA, KATSUMI;YAMABE, HIROYUKI;NAKAYAMA, MASAO |
发明人 |
AKIYOSHI, NAOYOSHI;NAKADA, KIMIO;KODA, KATSUMI;YAMABE, HIROYUKI;NAKAYAMA, MASAO |
分类号 |
B22F3/00;C22C1/04;C22C27/04;H01H1/025;H01L23/06;H01L23/373;H01L23/532;(IPC1-7):C22C27/04;B22F9/22 |
主分类号 |
B22F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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