发明名称 COPPER-TUNGSTEN ALLOYS AND PROCESS FOR PRODUCING THE SAME
摘要 Copper-tungsten alloys comprising on the weight basis 5-30 % copper, 0.002-0.04 % phosphorus and the balance substantially consisting of tungsten, and preferably containing 0.1-0.5 % of one or more members selected among cobalt, nickel and iron. The alloys are used as electrode materials, contact materials, semiconductor packaging materials, heat sinks, and so forth.
申请公布号 WO9622401(A1) 申请公布日期 1996.07.25
申请号 WO1996JP00080 申请日期 1996.01.19
申请人 TOHO KINZOKU CO., LTD.;AKIYOSHI, NAOYOSHI;NAKADA, KIMIO;KODA, KATSUMI;YAMABE, HIROYUKI;NAKAYAMA, MASAO 发明人 AKIYOSHI, NAOYOSHI;NAKADA, KIMIO;KODA, KATSUMI;YAMABE, HIROYUKI;NAKAYAMA, MASAO
分类号 B22F3/00;C22C1/04;C22C27/04;H01H1/025;H01L23/06;H01L23/373;H01L23/532;(IPC1-7):C22C27/04;B22F9/22 主分类号 B22F3/00
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