| 摘要 |
PURPOSE:To prevent an unnecessary contact part from being caused by a method wherein a vacuum suction port is installed in a slope opposite to the wire supply side at a tip part of a bonding tool in order to raise a wire along the slope when the wire is pressed. CONSTITUTION:A wire 3 entering a second bonding point from a first bonding point is pressed along a slope 24 due to vacuum suction through a suction hole 26 when a tool 20 is lowered; a tilt near the second bonding point almost coincides with a tilt of the slope 24. When a reverse bonding operation is executed on a semiconductor chip 4 where a wiring part 5a or the like exposed to the outside of an electrode 5 exists, a problem that the wire 3 comes into contact with the wiring part 5a is eliminated; reliability of a product is enhanced. |
