Solder pad configuration for wave soldering

摘要

The printed circuit board assembly comprises a surface mount device having two ends wave soldered to the printed circuit board. A first solder pad is deposited on the printed circuit board having a width not greater than the width of the first end. A second solder pad is deposited on the printed circuit board having a width greater than the width of the second end. The two pads are oriented so that the first end is wave soldered to the first pad before the second end is wave soldered to the second pad. The two solder pads are rectangular. The second solder pad has rounded corners.