发明名称 Process for copper plating a wiring board
摘要 An electroless nickel plating is used as a primer for electroplating of copper. Preferably, electroless nickel plating is conducted after the surface of aluminum is subjected to nickel substitution with a nickel salt under a strongly acidic condition (pH: 1 or less). More preferably, the nickel substitution is carried out after the oxide film on the surface of aluminum is removed.
申请公布号 US5538616(A) 申请公布日期 1996.07.23
申请号 US19950457785 申请日期 1995.06.01
申请人 FUJITSU LIMITED 发明人 ARAI, KEIJI
分类号 H05K3/24;C23C18/32;H05K1/09;H05K3/26;H05K3/42;H05K3/46;(IPC1-7):C25D5/00 主分类号 H05K3/24
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