| 摘要 |
A tape having a predetermined area is provided for a chip. A hole is drilled within the predetermined area. The chip is adhered to the predetermined area by underfilling an underfill material between the chip and the tape from one side of the chip. By the hole, the invention provides a short path for effectively dissipating gas to prevent voids from forming between the tape and the chip while the underfill material is applied.
|
