| 摘要 |
PROBLEM TO BE SOLVED: To adjust the distribution of conductive particles and inhibit the precipitation phenomenon of the conductive particles in the formation of an electrical interconnection structure. SOLUTION: Of substrates 10, 40 for connection, one substrate 10 is first ejected and applied with conductive particles 50 on its connecting surface, i.e., its surface on which electrical terminals 20 are provided, and then a pure paste 30 is applied to the connecting surface of the other substrate 40. The substrates 10, 40 are interconnected so that the corresponding electrical terminals 20 on the substrates 10, 40 are electrically interconnected to each other via the conductive particles 50. Therefore, since the paste 30 is not initially mixed with the conductive particles 50 but during the connecting together of the substrate 10, 40, the precipitation phenomenon of the conductive particles 50 in the paste 30 with the lapse of time can be overcome, and adjustment of the distribution of the conductive particles 50 is made easier. |
