发明名称 |
Article comprising a PB-free solder having improved mechanical properties |
摘要 |
Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183 DEG C.+/-10 DEG C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.
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申请公布号 |
US5538686(A) |
申请公布日期 |
1996.07.23 |
申请号 |
US19940278673 |
申请日期 |
1994.06.27 |
申请人 |
AT&T CORP. |
发明人 |
CHEN, HO S.;JIN, SUNGHO;MCCORMACK, MARK T. |
分类号 |
B23K35/26;C22C13/00;H01L21/60;H05K3/34;(IPC1-7):C22C13/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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