| 摘要 |
<p>PURPOSE: To provide a sheet without a local stress concentration at a pickup because of having excellent extensibility, sufficient stress-relaxing property, and exhibiting invariant adhering force to a semiconductor wafer before and after irradiation of ultraviolet rays and/or radioactive rays even exposed to heat or a fluorescent light for a long time. CONSTITUTION: In a sheet comprising a base material having a transmitting property to ultraviolet rays and radioactive rays and an adhesive layer curing by polymerization with ultraviolet rays or radioactive rays, the base material has properties of 800g/cm <= stress at 25% elongation < 1600 g/cm and 200 g/cm <= residual stress after 60sec<400g/cm, and the adhesive layer contains 0.05-15 pts.wt. of a curing agent, 30-150 pts.wt. of multifunctional urethane acrylate-based oligomer, 0.03-22.5 pts.wt. of a photopolymerization initiator and 1-30 pts.wt. of an adhesion-giving resin to obtain an adhesive sheet for a semiconductor wafer processing.</p> |
