发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE ENCAPSULATED THEREBY
摘要 The epoxy resin is composed of 100 wt% epoxy resin like biphenyl epoxy resin, novolak epoxy resin, moified novolak epoxy resin or bisphenol epoxy resin of A type, 10-80 wt% phenol resin like novolak phenol resin, phenolalkyl resin, bisphenol of A type or modified phenol resin, 20-70 wt% modified vinylester resin, 1-20 wt% coupling agent, 500-900 wt% filler like synthetic silicon containing uranium and thorium below 1.0 ppb and other additives.
申请公布号 KR960009695(B1) 申请公布日期 1996.07.23
申请号 KR19920026310 申请日期 1992.12.29
申请人 KOREA CHEMICAL CO., LTD. 发明人 PARK, SE - DONG;CHO, YONG - SUK;SIM, JAE - WOOK
分类号 C08L63/00;H01L23/29;(IPC1-7):C08L63/00 主分类号 C08L63/00
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