BALL AND METHOD FOR BONDING SEMICONDUCTOR CHIP

摘要

PURPOSE: To improve bonding reliability between a semiconductor chip and a board, by reducing irregularity of the grain diameter of a ball for bonding semiconductor chip. CONSTITUTION: A ball 1b for bonding semiconductor chip is constituted of a fine grain 2 and a Pb based plating film 3 which is formed on the fine grain 2 by a nonelectrolytic plating method. It is desirable to form a metal covering film 4 for decreasing the melting point of the Pb based plating film on the Pb based plating film 3. The ball 1b for bonding semiconductor chip is used for the bonding of a flip chip system or a BGA system.