| 摘要 |
The process involves optimizing the load conditions for the machined surfaces of the components, selecting and applying the optimum permissible specific force applied to the tool in the light of the relative thickness of the machined component, and using laser cutting to cut the edges of the components to size after the surface of the components has been machined. The process disclosed is carried out using a novel diamond-abrasive tool and novel designs for the devices concerned. According to one variant, the device comprises a surface plate (1) with a diamond-abrasive tool and a surface plate (2) arranged eccentricaly on which are mounted holders (5) with recesses for the components (4). Each recess has a resilient lining (6). Force is applied by means of a clamping mechanism (7). When the surface plates are displaced in relation to each other and the diamond-abrasive layer on the tools is used with a specified configuration and composition of the preforms, and also of the resilient linings whose thickness is calculated using the formula cited, the device in question facilitates the creation of the desired surface and adjustment of the force exerted by the tool on the component. <IMAGE> |
