发明名称 |
Resin molded type semiconductor device having a conductor film |
摘要 |
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.
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申请公布号 |
US5539257(A) |
申请公布日期 |
1996.07.23 |
申请号 |
US19950456942 |
申请日期 |
1995.06.01 |
申请人 |
HITACHI, LTD. |
发明人 |
HARA, YUJI;ITO, SATORU;TOYA, TATSURO |
分类号 |
H01L23/29;H01L23/31;H01L23/58;(IPC1-7):H01L27/02;H01L29/34;H01L23/48;H01L29/44 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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