摘要 |
There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a styrene/ethylene/butene/styrene block copolymer, a ethylene/acrylic acid-type copolymer, and a polyamide/polyether copolymer in a specific ratio, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided, and has a transfer-preventing layer laid, directly or through a bonding layer, on the other surface of the center layer. There is also disclosed a semiconductor wafer-securing adhesive tape wherein the center layer of said semiconductor wafer-securing adhesive tape has a film comprising said SEBS block copolymer or SEPS block copolymer, an amorphous poly alpha -olefin, and a polyamide/polyether copolymer, in a specific ratio.
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申请人 |
FURUKAWA ELECTRIC CO., LTD. |
发明人 |
NAKAYAMA, KOJI;MOUGI, KENJI;SHIRAMATSU, EIJI;IWAMOTO, KAZUSHIGE;ISHIWATA, SHINICHI;HASEBE, MORIKUNI |