发明名称 SEMICONDUCTOR MODULE
摘要 PURPOSE: To make an equal amount of current flow through three semiconductor elements even in the case where the three semiconductor elements are mounted in a module. CONSTITUTION: Three diode elements 101, 102 and 103 are provided on a cathode side conductor pattern 104. The region lying across on the center line 116 of an insulating substrate 106 on an anode side conductor pattern 105 is used as the bonding region 203 of an anode side connection terminal. A conductor pattern 105 between this region 203 and the middle second diode element 102 is notched and a current bypass part 105a is formed on this pattern 105. A current path on the element 102 becomes longer by the formation of the bypass part 105a and becomes equal with current path lengths on the other elements 101 and 103. As a result, an equal amount of current flows through the elements 101, 102 and 103.
申请公布号 JPH08191130(A) 申请公布日期 1996.07.23
申请号 JP19950002818 申请日期 1995.01.11
申请人 HITACHI LTD;HITACHI HARAMACHI SEMICONDUCTOR LTD 发明人 KOIKE YOSHIHIKO;SAITO RYUICHI;SEKINE SHIGEKI;KOIKE SHINYA;KOKUBU HIDEYA
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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