| 摘要 |
PURPOSE: To prevent sinks of via conducting paste after filling and drying, by preparing first vehicle formed by mixing first solvent and high-molecular material and second vehicle formed by mixing second solvent and high-molecular material, and mixing the second vehicle after the first vehicle and inorganic composition are mixed. CONSTITUTION: The via conducting paste is used for a ceramic multilayered wiring board which is composed of organic material and organic vehicle of at least high-molecular material and solvent. The inorganic material is composed of conductive material or insulating material or composed of both of the conductive material and the insulating material. The solvent is composed of mixture of first solvent and second solvent. The first solvent is lower alcohol, orα- terpioneol, and the second solvent is diethylene glycol, monobutyl ether, etc. Sinks 3 after printing and drying the via conducting paste are remarkably reduced as compared with the conventional case. Inner voids are not generated between layers after glass ceramic green sheets 2 are laminated on a press. |
