| 摘要 |
The purpose of the present invention is to propose an apparatus for measuring wetness property of solder with very excellent measurement sensitivity. The apparatus for measuring wetness property of solder according to the present invention is characterized in that it comprises a differential transformer which is fixed, a balance which is supported by a balancing fulcrum, a metallic test piece which hangs from the detection element of said differential transformer through an end of said balance, a counterweight which hangs from the other end of said balance, a solder tank which is filled with molten solder, a vertical movement apparatus which moves up and down said solder tank, a contact detection circuit which produces an output signal when said metallic test piece comes into contact with said molten solder in said solder tank, and a data processing apparatus which gains the wet depth of said metallic test piece into said molten solder and the wetting speed by using the output signal from said contact detection circuit as a trigger and which indicates them. <IMAGE> |
