| 摘要 |
A new and improved process, and the apparatus produced by the process, in which plastic material forming the plastic body package (e.g., 130) of an integrated circuit device (110, 210, 310, 410, 510) is selectively removed and replaced with a radiation shield (172, 174, 272, 274, 372, 374, 472, 474, 572, 574) having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit device (110, 210, 310, 410, 510) is to be used. |
