发明名称 UMSCHLIESSEN EINES SUBSTRATES MIT EINEM WÄRMERÜCKSTELLBAREN ARTIKEL
摘要 A substrate (12, 14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12, 14). The adhesive composition can be in the form of a self-supporting sheet or tape or it can be on a surface of the heat recoverable article (10). When particulate conductive filler is added to the adhesive, a conductive polymer composition can be made. Such conductive compositions are suitable for use for static dissipation in an article of the invention, or in an electrical device, e.g. a heater or a circuit protection device.
申请公布号 DE69120286(D1) 申请公布日期 1996.07.18
申请号 DE1991620286 申请日期 1991.11.06
申请人 RAYCHEM CORP., MENLO PARK, CALIF., US 发明人 RINDE, JAMES, ARTHUR, FREMONT, CA 94539, US;BAIGRIE, STEPHEN, SWINDON, WILTSHIRE, GB;CHU, EDWARD, F., SUNNYVALE, CA 94087, US;PARK, GEORGE, BARRY, SWINDON, WILTSHIRE, GB;REDDY, VIJAY, N., SAN MATEO, CA 94403, US;SALTMAN, ROBERT, P., REDWOOD CITY, CA 94062, US
分类号 B29C63/42;B29C61/06;B29C65/68;B29K101/10;C09J5/06;C09J7/00;C09J7/02;C09J163/00;F16L13/10;H01C7/02 主分类号 B29C63/42
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