| 摘要 |
<p>Use in the technical field of plasma treatment of planar elements such as plates, sheets and wafers in electronics and electrical engineering, the invention in essence is a device for treating planar elements with a plasma jet. The device comprises the following elements mounted in a closed chamber (1): a drive (12) which effects angular displacement of the holders (14) which are provided with a common rotary drive (18); a plasma jet generator (10); and, mounted outside the closed chamber (1), a manipulator (27) and storage units (28) for the elements (29). The element requiring treatment (29) is selected by the manipulator (27) from the storage device (28) and placed in the holder (14) which together with the element (29) passes over the plasma jet generator (10) used for the treatment. The cycle may be repeated a desired number of times.</p> |
