发明名称 |
Solder bonded parallel package structure and method of solder bonding. |
摘要 |
Disclosed is a method of laminating circuitized polymeric dielectric panels with pad to pad electrical connection between the panels. This pad to pad electrical connection is provided by a transient liquid phase formed bond of a joining metallurgy characterized by a non-eutectic stoichiometry composition of a eutectic forming system. The eutectic temperature of the system is below the first thermal transition of the polymeric dielectric, and the melting temperature of the joining metallurgy composition is above the first thermal transition temperature of the polymeric dielectric. <IMAGE> |
申请公布号 |
EP0637030(A3) |
申请公布日期 |
1996.07.17 |
申请号 |
EP19940109623 |
申请日期 |
1994.06.22 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GALASCO, RAYMOND THOMAS;MOLLA, JAYNAL ABEDIN |
分类号 |
G06F15/173;G06F15/80;G11C5/00;H01L23/48;H01L23/52;H05K1/00;H05K3/00;H05K3/32;H05K3/46;(IPC1-7):G11C5/00 |
主分类号 |
G06F15/173 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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