发明名称 Laminated electronic part
摘要 <p>A high degree of freedom of design and high density mounting are achieved with a laminated electronic part (1) having a structure such that the occurrence of floating capacitance can be restrained. The laminated electronic part (1) is formed of a first layer (2) a second layer (3) which are joined to each other with a third layer (4) sandwiched therebetween. The first and second layers (2, 3) may be formed of dielectrics having substantially different respective dielectric constants, and the third layer (4) is formed of a dielectric having a dielectric constant lower than that of the first and second layers (2, 3), or an insulator. Connecting conductors are provided inside the third layer (4). A through-conductor inside the first layer (2) can be connected to a through-conductor inside the second, for example, layer (3) via the connecting conductor inside the third layer (4). <IMAGE></p>
申请公布号 EP0722186(A2) 申请公布日期 1996.07.17
申请号 EP19960400081 申请日期 1996.01.12
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MORIYASU, AKIYOSHI;MORISHIMA, YASUYUKI
分类号 H01L23/12;H01L23/538;H05K1/03;H05K1/16;H05K3/46;(IPC1-7):H01L23/538 主分类号 H01L23/12
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