| 摘要 |
PURPOSE: To improve yield, reliability, and access speed without increasing the area of a chip even if capacity enlargement and high integration are in progress. CONSTITUTION: Word suspension wirings corresponding to each of plural word lines WLi are made first and second word suspension wirings WL1i and WS2i in two layers with an insulating layer between, and these first and second word suspension wirings are divided in the longitudinal direction of the word line WLi and alternately to adjacent word lines. The first word suspension wiring WS1i on the side near the word line WLi and the corresponding word line are connected with a first contact hole CH1. The first and second word suspension wirings corresponding to each other are connected with each other with a second contact hole CH2. |
