发明名称 SOLDER RESIST, FORMING METHOD THEREOF, AND SOLDER SUPPLY METHOD
摘要 PURPOSE: To enable a solder coat to be optionally controlled in thickness by a method wherein the inner wall of an opening is terraced. CONSTITUTION: The inner wall of an opening 14A provided to a solder resist 14 is terraced, and the upper stepped parts 13A of the opening 14a are not more limited in size and shape than the lowest part 12A. Therefore, the stepped parts 13A which form the terraced opening 14A of the resist 14 are properly set in shape, whereby the opening 14A of the resist 14 is optionally set in volume as a whole. Therefore, solder fed to the solder supplying spot of a work 10 is capable of being controlled in volume, so that a solder coat formed on the solder supply spot 15 can be optionally controlled in thickness.
申请公布号 JPH08186361(A) 申请公布日期 1996.07.16
申请号 JP19940340515 申请日期 1994.12.28
申请人 SONY CORP;DU PONT KK 发明人 ITOU MUTSUSADA;KOSHIRO HIROKI
分类号 H05K3/34;H01L21/321;H01L21/60 主分类号 H05K3/34
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