| 摘要 |
PURPOSE: To stably seal a semiconductor element with resin by mounting the first resin sheet on the unconnected surface of the semiconductor element mounted on a frame body with respect to a lead, and directly supplying the second resin sheet on the lower die of a metal mold. CONSTITUTION: A lead frame 15, on which a semiconductor element 14 is mounted, is turned over beforehand, and a resin sheet 12 is mounted on the unconnected surface of the semiconductor element 14 and a lead 15a. Meanwhile, the resin sheet 12 is sucked by a suction arm 13 and supplied to a lower-die compressing mechanism 11a of a metal mold 11. The lead frame 15 is supplied into the upper and lower dies 11 through a guide rail 16 at the almost same time of the feeding of the resin sheet 12 to the lower-die compressing mechanism 11a or immediately after the feeding. Thereafter, the upper and lower dies 11 are closed, and the part of the lead 15a of the lead frame 15 is held. Then, clamping is performed by the upper and lower compressing mechanisms 11a and 11b, the resin sheet 12 is molded under the high temperature and high pressure and the surrounding part of the element 14 is coated with the resin 18. |
