| 摘要 |
PURPOSE: To discharge adhesive in correspondence with the size of the adhesive surface of a semiconductor chip without replacing even when the size of the semiconductor chip is changed in a dispenser nozzle, which applies adherend for bonding the semiconductor chip to a board. CONSTITUTION: A container 2 has a plurality of nozzles 4, which are protruding downward from the lower surface, and adherend is supplied through the nozzles. The flat surface of the container has passing holes 4a for supplying the adherend into the nozzles 4. A sliding plate 1a, which is slid and moved on the flat surface so as to close the adherend passing holes 4a selectively, is provided in the container 2. Thus, the applying area of the adherend on the board is changed.
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