| 摘要 |
<p>PURPOSE: To simplify wiring board process and to improve production efficiency by covering a housing hole for mounting electronic parts with a plug which is detachably inserted into an upper opening and performing plating to an outermost layer insulation substrate surface and a through hole. CONSTITUTION: A lowermost insulation substrate 1d, a specific number of inner- layer circuit substrates 1n, and an uppermost insulation substrate 1u are pressed and joined to one another through an adhesive sheet 7 and a laminated body 10 where a housing hole 2 for mounting electronic parts is formed by each opening 6u, 6n... which gradually become smaller toward the lower part from the uppermost insulation substrate 1u to the inner-layer circuit substrate 1n. Then, a through hole 3 through the pressed and joined laminated body 10 is formed and a plug 9 which can be attached to and detached from the upper opening 6u is inserted, thus covering the housing hole 2 and then performing plating to outermost-layer insulation substrate surfaces 1e, 1e and the through hole 3. After that, a conductor circuit 4 is formed at the substrates 1e, 1e. Then, the plug 9 is eliminated and the housing hole 2 is opened and then gold plating 18 is performed to the exposed conductor circuit 4 and the through hole 3.</p> |
