| 摘要 |
PURPOSE: To realize compactness and improvement of humidity resistance of an electronic component of two-terminal structure. CONSTITUTION: In a semiconductor device having a package 2 formed of resin and external electrodes 3a, 3b exposed from a package, the external electrode is provided on the package bottom side and is extended within an outline of a package. The external electrode is formed to bite into a package. A projection 5 which bites into a package is provided inside the external electrode. Since the external electrode does not protrude outside an outline of a package, a resin sealed electronic component can be miniaturized. Since the external electrode bites into a package and a projection which bites into a package is provided inside the external electrode, adhesion between the external electrode and the package can be improved and humidity resistance can be improved.
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