| 摘要 |
PURPOSE: To surely bond a chip without forming an air reservoir by equipping an inner lead which fronts on the island on which to bond a chip, and bending the topside of the island to be convex up. CONSTITUTION: An island 6 on which to bond a chip-is pressed by a pressing tool 9, which has a concave face 9a at the bottom, after placing an inner lead 7 with a thickness H on a flat pad 8. By this press, the thickness H 1 at the center of the island 6 becomes thicker than that H0 at the periphery, being curved to be convex up. Hereby, even if a chip is curved, being pressed, an adhesive sticks to both of the chip and the island 6, and the chip can be bonded surely without forming an air reservoir. |
