| 摘要 |
PURPOSE: To provide a highly reliable semiconductor device whose electrical characteristic is stable by keeping a bonding position of a semiconductor chip on an island part further precisely. CONSTITUTION: In a semiconductor device provided with a semiconductor chip 3 wherein electrode components 1, 2 are formed in an upper surface, a lower surface side lead terminal 5 connected to a lower surface of a semiconductor chip through solder 4, upper surface side lead terminals 6, 7 connected to an electrode component and a mold part 9 covering the semiconductor chip 3 so that upper surface side and lower surface side lead terminals project from a surface, a lower surface side lead terminal is provided with a recessed part 10 in a part corresponding to an outer edge in a lower surface of the semiconductor chip. |
