| 摘要 |
PURPOSE: To prevent a metallic body applied to a printed wiring board from peeling. CONSTITUTION: A chip carrier 1 which is provided with a printed wiring board 2 and a metallic body 3 for mounting a semiconductor chip in face down bonding to the printed wiring board 2 is provided with a pressing frame 4 which has a plane 14 in opposition to the printed wiring board 2, presses the metallic body 3 to the printed wiring board 2 in the plane 14, bends along a side surface 12 of the printed wiring board 2 and has a stopping part 6 which stops at an edge face of the printed wiring board 2. |
