| 摘要 |
PURPOSE: To provide a method of manufacturing an injection-molded circuit part, wherein a composite molded body is enhanced in releasability from a mold, pattern form accuracy, and solderability at surface-mounting, and secondary molding resin is prevented from covering a primary molded body. CONSTITUTION: A composite molded body 4 is composed of a primary molded body 9 formed of electroless plating catalyst-containing first thermoplastic resin and a secondary molded body 10 formed of electroless plating catalyst-free second thermoplastic resin, and a part of the primary molded body 9 is exposed on the surface of the composite molded body 4, and the exposed part of the primary molded body 9 is subjected to electroless plating for the formation of an injection-molded circuitl part 1, wherein the side face of the composite molded body 4 is formed projecting outwards so as to be V-shaped in cross section. |
