| 摘要 |
PURPOSE: To obtain the package, of a face-type semiconductor light-emitting element, which can dissipate heat from the surface side while light is being emitted to the surface side of the element by a method wherein the semiconductor light-emitting element is pasted so as to correspond to a wiring pattern formed on the light-emitting element side of a package window part. CONSTITUTION: A package is provided with a plurality of semiconductor light-emitting elements 31 (LDs) which emit light to the upper side with reference to a semiconductor substrate 35 and with a package window part 32 which is composed of a transparent heat sink. A wiring pattern 41 is formed on the light-emitting element side of the package window part 32, and the semiconductor light-emitting elements 31 are pasted so as to correspond to the wiring pattern 41. That is to say, the wiring pattern 41 is formed on the transparent heat sink 32, and the plurality of semiconductor light- emitting elements 31 (LDs) which emit light to the upper side with reference to the semiconductor substrate 35 are pasted on the side of the wiring pattern. Then, the plurality of semiconductor light-emitting elements are sealed with a resin 33 so as to be covered, and the transparent heat sink 32 is divided into a plurality of packages by a dicing operation. |
