| 摘要 |
PURPOSE: To eliminate the need for prepreg and to substrate synthesis operation by polymerizing a flexible substrate material onto a pattern-formed rigid substrate via an insulation layer. CONSTITUTION: A copper foil 2 is applied to both surfaces of a glass epoxy resin plate material 1. One surface of the resin plate material 1 is coated with solder resist ink 7 and a flexible substrate material 8 where copper foil is applied on one surface is thermocompressed to a solder resist ink coated surface via the solder resist ink 7 so that a copper foil becomes an outer surface. After the compression, the solder resist ink 7 is cured by drying. After thermocompressing the flexible substrate 8 to the other surface of the resin plate material 1 via the solder resist ink 7, a lamination plate where an inner- layer circuit is formed is constituted by curing solder resist ink. Further, a multilayer wiring board is completed by drilling, through hole plating, and formation of an outer-layer pattern. |
