发明名称 MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE: To provide a method of easily manufacturing a multilayer printed wiring board of high positional accuracy at a low cost. CONSTITUTION: A mirror plate 11a is provided with positioning reference pins 10 and used for manufacturing a printed wiring board, inner layers 7 and a prepreg 12 where reference holes are provided corresponding to the reference pins 10 provided to the mirror plate 11a are pinched between a steel laminating jig 8 and the mirror plate 11a, and the inner layers 7 are fixed in position with laminating pins 9 and the positioning reference pins 10 and bonded together with the prepreg 12 by thermocompression, whereby a printed wiring board of high positional accuracy is obtained.
申请公布号 JPH08186377(A) 申请公布日期 1996.07.16
申请号 JP19940327209 申请日期 1994.12.28
申请人 NEC TOYAMA LTD 发明人 NAKAMURA SATOSHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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