| 摘要 |
PURPOSE: To reduce manufacturing cost by simplifying the lamination process of a multilayer printed wiring board consisting of at least five layers. CONSTITUTION: An insulation layer 4 is formed on the surface of a printed wiring board where at least a conductor circuit 3 of a first layer is formed on a substrate 1 by opening a land 5, a conductor circuit 6 is formed by conductive paste on the surface of an insulation layer 4, at the same time the conductor circuit 6 is electrically connected to the land 5 of the first layer, and prepreg 7 and copper foil 8 are laminated successively on the surface of the conductor circuit 6 formed by the conductive paste. |
