INTEGRATED CIRCUIT MICRO-COOLER HAVING TUBES OF A CNT ARRAY IN ESSENTIALLY THE SAME HEIGHT OVER A SURFACE

摘要

Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink, where the nanotubes are cut to essentially the same length over the surface of the structure, are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface having high axial and lateral thermal conductivities.