| 摘要 |
PURPOSE: To obtain a semiconductor package, and a manufacturing method thereof, in which the lead frame pad and the inner lead of the lead frame are soldered directly. CONSTITUTION: Pads are arranged at predetermined positions of a lead frame 40 and an inner lead 13 and an auxiliary lead 12 are disposed on the opposite sides of the pad. At least one inner lead hole 25 is made at the coupling part of the inner lead 13 and the auxiliary lead 12 while at least one solder resist hole 35 is made in a solder resist film 30 above the inner lead hole 25 such that it is conducted to the inner lead hole 25. |
