| 摘要 |
<p>PURPOSE: To provide a lead frame on which multipin, high-speed, or high-heat- generating semiconductor elements can be mounted easily in high density, and a semiconductor integrated circuit device using it. CONSTITUTION: The lead part 1d of a lead frame 1 extended outward from the body 4 where a semiconductor element 3 is sealed with resin has tow-layer structure consisting of two conductor members laminated with each other with an insulating member 2 between, and the two-layer structure has a signal layer 1a consisting of a plurality of linear signal lines and a plate-shaped ground layer 1b having an area covering roughly all the surface and besides provided with a mount for a semiconductor element. And, the outer lead part 1d in two- layer structure in the lead part 1d is cut after sealing with resin, and only the semiconductor element mounting side of the lead frame 1 is sealed with resin.</p> |
