PRINTED BOARD, MANUFACTURE THEREOF, AND PRINTED CIRCUIT ASSEMBLY PROVIDED THEREWITH

摘要

PURPOSE: To obtain an electronic apparatus high in reliability even if a semiconductor device is increased in heat release value due to the enhancement of circuits in degree of integration and mounting density by a method wherein a striped metal plate formed through such a manner that Fe-Ni alloy layers and Cu metal layers are alternately formed so as to be arranged in stripes extending in the same direction on its surface is made to serve as a printed board. CONSTITUTION: A printed board 8 is composed of a board 5 and a circuit pattern 7 formed on the board 5 through the intermediary of an insulating material 6, wherein a striped metal plate 1 formed through such a manner that Fe-Ni alloy 2 and Cu metal are alternately laminated so as to be arranged in stripes extending in the same direction on its surface is made to serve as the board 5. 42% Ni or 35 to 37% Ni alloy called as invar small in thermal expansion coefficient is used as the Fe-Ni alloy 2, and Cu or Cu-P alloy or Cu-Sn alloy of thermal conductivity 393W/mK±10% or so is used as the Cu metal. Therefore, the metals 2 and 3 are controlled in the ratio of them to each other, whereby heat released from the printed board 8 is dissipated through the base board 5 as required.