| 摘要 |
PURPOSE: To provide a semiconductor device having outer terminal configuration free from the problem concerning mechanical strength, by restraining reduction of area necessary for semiconductor element mounting, thinning, and the microminiaturizing of outer electrode terminal gap of a semiconductor package. CONSTITUTION: A semiconductor element 12 is bonded to a semiconductor carrier 11, with conducting adhesive agent 19 formed on bumps 18 by a flip-chip bonding method. The gap between the semiconductor carrier 11 and the semiconductor element 12, the periphery of the semiconductor element 12, and an aperture 14 of the semiconductor carrier 11 are filled and covered with epoxy based sealing resin 13. Since the semiconductor carrier 11 has the aperture 14, stress of the semiconductor carrier 11 is relieved by the aperture 14 which stress is caused by the shearing stress in the case of bonding of the semiconductor carrier 11 and the semiconductor element 12. Thereby defect like bonding deviation of the semiconductor carrier 11 and the semiconductor element 12 can be solved. |
