OPENING-PART BURYING DEVICE AND MANUFACTURE OF SEMICONDUCTORELEMENT USING IT

摘要

PROBLEM TO BE SOLVED: To prevent a void or an aggregation phenomenon by heating a board simultaneously with rotation in the process for filling an opening. e.g. a trench or contact hole, with a substance layer thereby causing the substance layer to flow. SOLUTION: When a motor 105 is operated to turn the rotary shaft 100 thereof, a large number of plates 110, each coupled with the rotary shaft 100 while mounting a wafer 115 on the rotary shaft 100 side, are also rotated. At the same time, a heater 120 is operated to heat the wafer 115. The wafer 115 is subjected to centrifugal force through the rotation and a substance layer is subjected to a force directing downward of the wafer 115. When the wafer 115 is heated, the substance layer is fluidized. During the process, inert gas is injected from a gas injecting section 125 into a chamber 140. With such arrangement, the opening can be filled with no void.