| 摘要 |
PURPOSE: To surely avoid deterioration of electric properties or deterioration of outward appearance caused by the flow of sealing resin without increasing the external dimensions. CONSTITUTION: A semiconductor package 11 is constituted by mounting a heat sink 12 on the base unit 25 having an i/o terminal 29. There is an electronic parts mounting area for mounting an LSI chip 19, etc., as electronic parts, in the high-density wiring layer B of the heat sink 12. A plurality of connector terminals 22 are made at the margin of the electronic parts mounting region. A plurality of bonding pads 30 are made on the side of a base unit 25, too. The bonding pad 30 and the connector terminal 22 are electrically connected with each other through a bonding wire, and the same section is sealed with sealing resin 36. At the inwall face of a window 26 is made a step 27a for step, which has a top lower than the i/o terminal formation face of a printed wiring board 40. At the topside of the step 27a, a bonding pad 30 is made. |
