MANUFACTURE OF METALLIC FOIL FOR PRINTED WIRING BOARD

摘要

PURPOSE: To realize a metallic foil for a printed wiring board which restrains electrodeposition stress well by forming a nickel-phosphorus alloy layer of a specified thickness by using nickel-phosphorus plating solution and by forming a copper layer which becomes a circuit in a surface thereof. CONSTITUTION: Nickel-phosphorus plating solution is used, wherein concentration of naphthalene sulfonic acids, O-sulfobenzonic acid imide or alkali metal salt thereof is in the range of 2 to 20g/l and concentration of magnesium salt is in the range of 10 to 200g/l. A 0.04 to 1.5μm-thick nickel-phosphorus alloy layer is formed by electroplating by using the nickel-phosphorus plating solution in one side of a copper foil which becomes a carrier, and a copper layer to become a circuit is further formed in a surface thereof. Therefore, electrodeposition stress of a nickel-phosphorus alloy layer by nickel-phosphorus electroplating solution containing magnesium salt is greatly reduced and curling of a metallic foil provided with a copper layer for forming a circuit in a surface thereof can be eliminated.