| 摘要 |
<p>PURPOSE: To get an object which is excellent in head radiation property and has a small thermal expansion difference with an Si chip, and besides is small in specific gravity, by arranging this heat spreader such that this consists of fiber-reinforcing resin for carbon fiber filaments, and that the filament is buried, passing through it in the direction of opposite face from a chip mounting face. CONSTITUTION: This heat spreader consists of the fiber reinforcing resin 4 for a carbon fiber filament 2, and the filament 2 is buried, passing through it in the direction of opposite face from a chip mounting face, and also it is restricted within the orthogonal face in that direction. For example, a prepreg where carbon fiber filament 2 of two-dimensional fabric is impregnated with epoxy resin or phenol resin as resin 3 is rounded spirally with the longitudinal direction of the filament 2 as the axis. Epoxy resin or phenol resin is stuck as resin 3 to the periphery of the bar-shaped one, and is pressed and and hardened at high temperature so as to form a fiber-reinforced resin bar being a square pillar, and the resin bar is cut, with the face orthogonal to the axis as the cutting face, so as to get a heat spreader.</p> |
