发明名称 TRANSVERSE RESONANCE TUNNELING
摘要 <p>PROBLEM TO BE SOLVED: To obtain a traversal resonance tunneling structure, and a simple fabrication method thereof, in which sublithography components for forming the line width is formed through a large number of angled deposition for more than one tunneling barrier and a quantum well being formed simultaneously between them. SOLUTION: A resonance tunneling diode 400 is etched in a traversal quantum well 406 and transports carriers laterally through tunneling barriers 404, 408 being grown at the time of refilling a groove for forming a quantum wire or a quantum dot. In the fabrication, angled deposition is employed in order to create an overhang at the top of an opening for defining the sublithography isolation with respect to the position of tunneling barrier.</p>
申请公布号 JPH08181335(A) 申请公布日期 1996.07.12
申请号 JP19950241538 申请日期 1995.09.20
申请人 TEXAS INSTR INC <TI> 发明人 BURIAN DEII SUMISU;JIYON ENU RANDOORU;GEIRII EI FUREIZAA
分类号 H01L29/06;H01L21/20;H01L29/12;H01L29/88;(IPC1-7):H01L29/88 主分类号 H01L29/06
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