发明名称 FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE: To provide a flexible printed wiring board highly reliable when connected by means of wire bonding, and a method for manufacturing it by suppressing the warp of a base film. CONSTITUTION: This flexible printed wiring board has a base film 10 consisting of a fiber impregnated with a synthetic resin 109 and a conductor pattern 96 formed on the front side surface 91 of the base film. Both the front side surface 91, which is a conductor pattern forming surface of the base film, and a rear side surface 92 thereof have rough surfaces R. The rear side surface 92 of the base film has more synthetic resin than the front side surface 91 thereof. The base film 10 is obtained by polishing the front side surface 92 more than the rear side surface 92. Preferably, the polishing of the front side surface 91 is 2-10μm deep and the polishing of the rear side surface 92 is 1-2μm deep.
申请公布号 JPH08181397(A) 申请公布日期 1996.07.12
申请号 JP19940335737 申请日期 1994.12.20
申请人 IBIDEN CO LTD 发明人 NAMIKAWA YOSHIHIRO
分类号 H05K1/02;H05K1/03;H05K3/22;(IPC1-7):H05K1/02 主分类号 H05K1/02
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