发明名称 BAKING METHOD FOR CERAMIC MULTILAYER CIRCUIT BOARD
摘要 PURPOSE: To expedite the supply of steam to a board and to shorten the time required to remove remaining oxygen by increasing the surface area of a ceramic circuit board in contact with baking atmosphere in the step of baking a ceramic multilayer circuit board. CONSTITUTION: A board 1 is placed on a setter 2 made of a ceramic plate, a metal plate or a porous plate. Vent holes 3 on a lattice are provided at the setter 2. Since wet nitrogen of the atmosphere is brought into contact with the surface of the lower side of the board via the holes, the steam is also supplied from the lower surface of the board. Further, when the porous material having the holes is used as the setter, even if the holes are not brought into contact with the board, the diffusing distance of the steam in the porous setter is shortened, and the steam supply via the setter is expedited. Thus, the time required for removing the remaining carbon in the remaining carbon removing step can be shortened.
申请公布号 JPH08181444(A) 申请公布日期 1996.07.12
申请号 JP19940319756 申请日期 1994.12.22
申请人 HITACHI LTD 发明人 KOYANAGI ASAKO
分类号 C04B35/64;H01B3/12;H05K3/46 主分类号 C04B35/64
代理机构 代理人
主权项
地址